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Capabilities & PCB Production


.003
Trace / Space
1. In House YAG/C02 Laser
2. Copper Filled Microvias (Stacked/Staggered)
3. Automated VIP Hole Fill and Planarization
4. Sequential Lamination with Precision Cool Down
5. Multilayer PTFE Hybrid Packaging for Manifolds, Radiators, Antennas, Radomes, and Tiles
6. Large Format 24 x 50 Panelization

ENIG
ENEPIG
Immersion Ag
Wire Bondable Au
Deep Hard Ni/Au W Tab
Horizontal HASL
Tin Lead Reflow






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