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Capabilities & PCB Production

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.003

Trace / Space

1.   In House YAG/C02 Laser 

2.   Copper Filled Microvias (Stacked/Staggered) 

3.   Automated VIP Hole Fill and Planarization 

4.   Sequential Lamination with Precision Cool Down 

5.   Multilayer PTFE Hybrid Packaging for Manifolds, Radiators, Antennas, Radomes, and Tiles 

6.   Large Format 24 x 50 Panelization

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ENIG

ENEPIG

Immersion Ag

Wire Bondable Au

Deep Hard Ni/Au W Tab

Horizontal HASL

Tin Lead Reflow

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6.    In House Machine Shop
7.    Three Dimensional Smart Products
8.    Horizontal/Vertical RF Launch Sites
9.    Active Cavity Construction with Thermal Floor
10.  Custom Baseplates for High Power Amplifiers
11.  Copper Pedestals with Selective Surface Finish
12.  Controlled Impedance +/-3%
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