• In House YAG/C02 Laser

• Copper Filled Microvias (Stacked/Staggered)

• Automated VIP Hole Fill and Planarization

• Sequential Lamination with Precision Cool Down

• Multilayer PTFE Hybrid Packaging for Manifolds, Radiators, Antennas, Radomes, and Tiles

• Large Format 24 x 50 Panelization

TECHNOLOGY

 

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.003"

trace/space

• ENIG

• ENEPIG

• Immersion Ag

• Wire Bondable Au

• Hard Ni/Au

• Horizontal HASL

• Tin Lead Reflow

• In House Machine Shop

• Three Dimensional Smart Products

• Horizontal/Vertical RF Launch Sites

• Active Cavity Construction with Thermal Floor

• Custom Baseplates for High Power Amplifiers

• Copper Pedestals with Selective Surface Finish

• Controlled Impedance +/-3%