• In House YAG/C02 Laser
  • Copper Filled Microvias (Stacked/Staggered)
  • Automated VIP Hole Fill and Planarization
  • Sequential Lamination with Precision Cool Down
  • Multilayer PTFE Hybrid Packaging for Manifolds, Radiators, Antennas, Radomes, and Tiles
  • Large Format 24 x 50 Panelization

TECHNOLOGY

 

.003"
trace/space
  • ENIG
  • ENEPIG
  • Immersion Ag
  • Wire Bondable Au
  • Hard Ni/Au
  • Horizontal HASL
  • Tin Lead Reflow
  • In House Machine Shop
  • Three Dimensional Smart Products
  • Horizontal/Vertical RF Launch Sites
  • Active Cavity Construction with Thermal Floor
  • Custom Baseplates for High Power Amplifiers
  • Copper Pedestals with Selective Surface Finish
  • Controlled Impedance +/-3%

© 2015 Lone Star Circuits