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In House YAG/C02 Laser
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Copper Filled Microvias (Stacked/Staggered)
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Automated VIP Hole Fill and Planarization
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Sequential Lamination with Precision Cool Down
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Multilayer PTFE Hybrid Packaging for Manifolds, Radiators, Antennas, Radomes, and Tiles
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Large Format 24 x 50 Panelization
TECHNOLOGY
.003"
trace/space


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ENIG
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ENEPIG
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Immersion Ag
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Wire Bondable Au
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Hard Ni/Au
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Horizontal HASL
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Tin Lead Reflow


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In House Machine Shop
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Three Dimensional Smart Products
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Horizontal/Vertical RF Launch Sites
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Active Cavity Construction with Thermal Floor
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Custom Baseplates for High Power Amplifiers
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Copper Pedestals with Selective Surface Finish
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Controlled Impedance +/-3%
© 2015 Lone Star Circuits